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Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging – ERRATUM
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- Journal:
- Journal of Materials Research / Volume 26 / Issue 14 / 28 July 2011
- Published online by Cambridge University Press:
- 26 July 2011, p. 1742
- Print publication:
- 28 July 2011
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- Article
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Formation of interfacial η′-Cu6Sn5 in Sn–0.7Cu/Cu solder joints during isothermal aging
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- Journal:
- Journal of Materials Research / Volume 26 / Issue 12 / 28 June 2011
- Published online by Cambridge University Press:
- 27 June 2011, pp. 1468-1471
- Print publication:
- 28 June 2011
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